All-Printed and Flexible Low-Cost Diodes for Reconfigurable Systems

In this project, the project team will utilize an additive manufacturing tool, such as aerosol jet printer, ink-jet printer, or plasma-jet printer to develop a low-cost flexible diode. In this project, the team will identify suitable material inks to be used through literature survey, develop diode layouts in AutoCAD, and test the printed components to determine their characteristic performance and how they compare against traditional CMOS counterparts. Time permitting, an array of diodes will be integrated within a device architecture to demonstrate reconfigurability of designs (e.g. reflectarrays).

Objectives

Objectives:

  1. Identify suitable material inks that would form the basis of diode architecture.
  2. Optimize printing parameters and characterize the performance of printed films.
  3. Develop AutoCAD layout for a diode.
  4. Characterize the performance of printed diodes and compare them to the state-of-the-art.

Deliverables:

  1. AutoCAD design layouts of diode architecture.
  2. Printed diode prototypes (8)
  3. Comprehensive characterization report of printed diode structures.

Motivations

Current reconfigurable flexible systems utilize rigid CMOS-based diodes that need to be ‘picked-and-placed’ onto flexible substrates. This make the overall system quite complex to build, expensive, and prone to failure. An integrated approach, that incorporates printed diodes within the overall printed device architecture will make the overall system simple and cost-effective. It is expected that such integration will reduce the cost of systems by up to 200X, enabling rapid deployment and use across various platforms. 

Qualifications

Minimum Qualifications:
  1. Pursuing a degree in electrical engineering

Preferred Qualifications:
  1. Pursuing a degree in EE
  2. Have basic understanding of how diodes operate.
  3. Be able to analyze the diode test results.
  4. Able to learn and apply printing tools for developing devices


Details

Project Partner:

Harish Subbaraman

NDA/IPA:

No Agreement Required

Number Groups:

1

Project Status:

Accepting Applicants

Website:
https://sites.google.com/view/osu-ampl/home
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